Water producing method

ABSTRACT

Disclosed herein is a wafer producing method for producing a hexagonal single crystal wafer from a hexagonal single crystal ingot. The wafer producing method includes a modified layer forming step of setting the focal point of a laser beam having a transmission wavelength to the ingot inside the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to the thickness of the wafer to be produced, and next applying the laser beam to the upper surface of the ingot as relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and cracks extending from the modified layer. In the modified layer forming step, the focal point of the laser beam is relatively moved from a radially inside position inside the ingot toward the outer circumference of the ingot.

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a wafer producing method for slicing ahexagonal single crystal ingot to produce a wafer.

Description of the Related Art

Various devices such as ICs and LSIs are formed by forming a functionallayer on the front side of a wafer formed of silicon or the like andpartitioning this functional layer into a plurality of regions along aplurality of crossing division lines. The division lines of the waferare processed by a processing apparatus such as a cutting apparatus anda laser processing apparatus to thereby divide the wafer into aplurality of individual device chips corresponding to the respectivedevices. The device chips thus obtained are widely used in variousequipment such as mobile phones and personal computers. Further, powerdevices or optical devices such as LEDs and LDs are formed by forming afunctional layer on the front side of a wafer formed of a hexagonalsingle crystal such as SiC and GaN and partitioning this functionallayer into a plurality of regions along a plurality of crossing divisionlines.

In general, the wafer on which the devices are to be formed is producedby slicing an ingot with a wire saw. Both sides of the wafer obtainedabove are polished to a mirror finish (see Japanese Patent Laid-open No.2000-94221, for example). This wire saw is configured in such a mannerthat a single wire such as a piano wire having a diameter of about 100to 300 μm is wound around many grooves formed on usually two to fourguide rollers to form a plurality of cutting portions spaced in parallelwith a given pitch. The wire is operated to run in one direction oropposite directions, thereby slicing the ingot into a plurality ofwafers.

However, when the ingot is cut by the wire saw and both sides of eachwafer are polished to obtain the product, 70 to 80% of the ingot isdiscarded to cause a problem of poor economy. In particular, a hexagonalsingle crystal ingot of SiC or GaN, for example, has high Mohs hardnessand it is therefore difficult to cut this ingot with the wire saw.Accordingly, considerable time is required for cutting of the ingot,causing a reduction in productivity. That is, there is a problem inefficiently producing a wafer in this prior art.

A technique for solving this problem is described in Japanese PatentLaid-open No. 2013-49161. This technique includes the steps of settingthe focal point of a laser beam having a transmission wavelength to SiCinside a hexagonal single crystal ingot, next applying the laser beam tothe ingot as scanning the laser beam on the ingot to thereby form amodified layer and cracks in a separation plane inside the ingot, andnext applying an external force to the ingot to thereby break the ingotalong the separation plane where the modified layer and the cracks areformed, thus separating a wafer from the ingot. In this technique, thelaser beam is scanned spirally or linearly along the separation plane sothat a first application point of the laser beam and a secondapplication point of the laser beam nearest to the first applicationpoint have a predetermined positional relation with each other. As aresult, the modified layer and the cracks are formed at very highdensity in the separation plane of the ingot.

SUMMARY OF THE INVENTION

However, in the ingot cutting method described in Japanese PatentLaid-open No. 2013-49161 mentioned above, the laser beam is scannedspirally or linearly on the ingot. In the case of linearly scanning thelaser beam, the direction of scanning of the laser beam is notspecified. In the ingot cutting method described in Japanese PatentLaid-open No. 2013-49161, the pitch (spacing) between the firstapplication point and the second application point of the laser beam asmentioned above is set to 1 to 10 μm. This pitch corresponds to thepitch of the cracks extending from the modified layer along a c-planedefined in the ingot.

In this manner, the pitch of the application points of the laser beam tobe applied to the ingot is very small. Accordingly, regardless ofwhether the laser beam is scanned spirally or linearly, the laser beammust be applied with a very small pitch and the improvement inproductivity is not yet sufficient.

It is therefore an object of the present invention to provide a waferproducing method which can efficiently produce a wafer from an ingot.

In accordance with an aspect of the present invention, there is provideda wafer producing method for producing a hexagonal single crystal waferfrom a hexagonal single crystal ingot having a first surface, a secondsurface opposite to the first surface, a c-axis extending from the firstsurface to the second surface, and a c-plane perpendicular to thec-axis. The wafer producing method includes a separation start pointforming step of setting a focal point of a laser beam having atransmission wavelength to the ingot inside the ingot at a predetermineddepth from the first surface, which depth corresponds to a thickness ofthe wafer to be produced, and next applying the laser beam to the firstsurface as relatively moving the focal point and the ingot to therebyform a modified layer parallel to the first surface and cracks extendingfrom the modified layer along the c-plane, thus forming a separationstart point; and a wafer separating step of separating a plate-shapedmember having a thickness corresponding to the thickness of the waferfrom the ingot at the separation start point after performing theseparation start point forming step, thus producing the wafer from theingot. The separation start point forming step includes a modified layerforming step of relatively moving the focal point of the laser beam in afirst direction perpendicular to a second direction where the c-axis isinclined by an off angle with respect to a normal to the first surfaceand the off angle is formed between the first surface and the c-plane,thereby linearly forming the modified layer extending in the firstdirection; and an indexing step of relatively moving the focal point inthe second direction to thereby index the focal point by a predeterminedamount. In the modified layer forming step, the focal point of the laserbeam is relatively moved from a radially inside position inside theingot toward an outer circumference of the ingot.

Preferably, the hexagonal single crystal ingot is selected from a SiCsingle crystal ingot, GaN single crystal ingot, and AlN single crystalingot.

According to the wafer producing method of the present invention, thefocal point of the laser beam is relatively moved in the first directionperpendicular to the second direction where the off angle is formedbetween the first surface and the c-plane of the ingot, thereby linearlyforming the modified layer extending in the first direction. Thereafter,the focal point of the laser beam is indexed in the second direction bythe predetermined amount. Thereafter, the focal point of the laser beamis relatively moved again in the first direction to thereby linearlyform the modified layer extending in the first direction. Such a seriesof steps are repeated to form a plurality of modified layers extendingin the first direction, wherein each modified layer is formed at thepredetermined depth from the first surface of the ingot and the cracksare formed on both sides of each modified layer so as to propagate alongthe c-plane. Accordingly, any adjacent ones of the plural modifiedlayers are connected together through the cracks formed therebetween, sothat the plate-shaped member having the thickness corresponding to thethickness of the wafer can be easily separated from the ingot at theseparation start point, thus producing the hexagonal single crystalwafer from the ingot.

The scanning direction of the laser beam is set to the first directionperpendicular to the second direction where the off angle is formed.Accordingly, the cracks formed on both sides of each modified layer soas to propagate along the c-plane extend very long, so that the indexamount of the focal point can be increased up to about 200 to 500 μm tothereby sufficiently improve the productivity. Further, the amount ofthe ingot to be discarded can be sufficiently reduced to about 30%.

Further, when the focal point of the laser beam is moved from the outercircumference of the ingot toward a radially inside position inside theingot, the power of the laser beam concentrated at the focal pointchanges from a low value to a high value during the movement from theouter circumference of the ingot toward the radially inside position.Thereafter, the power of the laser beam is kept stable at a high power.However, with this change in power of the laser beam from a low value toa high value, the position of the modified layer takes a parabolic pathto cause the formation of an undesired modified layer and cracks. As aresult, there is a possibility that the separation of the outercircumferential portion of the ingot in the wafer separating step maybecome difficult and chipping may also occur at the outercircumferential portion of the ingot, causing a reduction in quality. Incontrast, according to the present invention, the laser beam is appliedto the ingot as relatively moving the focal point of the laser beam fromthe radially inside position inside the ingot toward the outercircumference thereof, thereby forming a good modified layer and cracksinside the ingot. Accordingly, when the laser beam is scanned to passthrough the outer circumference of the ingot, a good modified layer andcracks can be formed also at the outer circumference of the ingot asbeing guided by the good modified layer and cracks previously formedinside the ingot. As a result, the outer circumferential portion of theingot can be easily separated without the occurrence of chipping in thewafer separating step, thus obtaining a wafer having good quality.

The above and other objects, features and advantages of the presentinvention and the manner of realizing them will become more apparent,and the invention itself will best be understood from a study of thefollowing description and appended claims with reference to the attacheddrawings showing a preferred embodiment of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a laser processing apparatus suitablefor use in performing a wafer producing method of the present invention;

FIG. 2 is a block diagram of a laser beam generating unit;

FIG. 3A is a perspective view of a hexagonal single crystal ingot;

FIG. 3B is an elevational view of the ingot shown in FIG. 3A;

FIG. 4 is a perspective view for illustrating a separation start pointforming step;

FIG. 5 is a plan view of the ingot shown in FIG. 3A;

FIG. 6 is a schematic sectional view for illustrating a modified layerforming step;

FIG. 7 is a schematic plan view for illustrating the modified layerforming step;

FIG. 8A is a schematic plan view for illustrating an indexing step;

FIG. 8B is a schematic plan view for illustrating an index amount;

FIG. 9 is a schematic plan view for illustrating a laser beam applyingmethod in performing the modified layer forming step;

FIGS. 10A and 10B are perspective views for illustrating a waferseparating step; and

FIG. 11 is a perspective view of a hexagonal single crystal waferproduced from the ingot.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

A preferred embodiment of the present invention will now be described indetail with reference to the drawings. Referring to FIG. 1, there isshown a perspective view of a laser processing apparatus 2 suitable foruse in performing a wafer producing method of the present invention. Thelaser processing apparatus 2 includes a stationary base 4 and a firstslide block 6 mounted on the stationary base 4 so as to be movable inthe X direction. The first slide block 6 is moved in a feedingdirection, or in the X direction along a pair of guide rails 14 by afeeding mechanism 12 composed of a ball screw 8 and a pulse motor 10.

A second slide block 16 is mounted on the first slide block 6 so as tobe movable in the Y direction. The second slide block 16 is moved in anindexing direction, or in the Y direction along a pair of guide rails 24by an indexing mechanism 22 composed of a ball screw 18 and a pulsemotor 20. A support table 26 is mounted on the second slide block 16.The support table 26 is movable in the X direction and the Y directionby the feeding mechanism 12 and the indexing mechanism 22 and alsorotatable by a motor stored in the second slide block 16.

A column 28 is provided on the stationary base 4 so as to project upwardtherefrom. A laser beam applying mechanism (laser beam applying means)30 is mounted on the column 28. The laser beam applying mechanism 30 iscomposed of a casing 32, a laser beam generating unit 34 (see FIG. 2)stored in the casing 32, and focusing means (laser head) 36 mounted onthe front end of the casing 32. An imaging unit 38 having a microscopeand a camera is also mounted on the front end of the casing 32 so as tobe aligned with the focusing means 36 in the X direction.

As shown in FIG. 2, the laser beam generating unit 34 includes a laseroscillator 40 for generating a pulsed laser beam such as YAG laser andYVO4 laser, repetition frequency setting means 42 for setting therepetition frequency of the pulsed laser beam to be generated from thelaser oscillator 40, pulse width adjusting means 44 for adjusting thepulse width of the pulsed laser beam to be generated from the laseroscillator 40, and power adjusting means 46 for adjusting the power ofthe pulsed laser generated from the laser oscillator 40. Althoughespecially not shown, the laser oscillator 40 has a Brewster window, sothat the laser beam generated from the laser oscillator 40 is a laserbeam of linearly polarized light. After the power of the pulsed laserbeam is adjusted to a predetermined power by the power adjusting means46 of the laser beam generating unit 34, the pulsed laser beam isreflected by a mirror 48 included in the focusing means 36 and nextfocused by a focusing lens 50 included in the focusing means 36. Thefocusing lens 50 is positioned so that the pulsed laser beam is focusedinside a hexagonal single crystal ingot 11 as a workpiece fixed to thesupport table 26.

Referring to FIG. 3A, there is shown a perspective view of the hexagonalsingle crystal ingot 11 as a workpiece to be processed. FIG. 3B is anelevational view of the hexagonal single crystal ingot 11 shown in FIG.3A. The hexagonal single crystal ingot (which will be hereinafterreferred to also simply as ingot) 11 is selected from a SiC singlecrystal ingot or a GaN single crystal ingot. The ingot 11 has a firstsurface (upper surface) 11 a and a second surface (lower surface) 11 bopposite to the first surface 11 a. The first surface 11 a of the ingot11 is preliminarily polished to a mirror finish because the laser beamis applied to the first surface 11 a.

The ingot 11 has a first orientation flat 13 and a second orientationflat 15 perpendicular to the first orientation flat 13. The length ofthe first orientation flat 13 is set greater than the length of thesecond orientation flat 15. The ingot 11 has a c-axis 19 inclined by anoff angle α toward the second orientation flat 15 with respect to anormal 17 to the upper surface 11 a and also has a c-plane 21perpendicular to the c-axis 19. The c-plane 21 is inclined by the offangle α with respect to the upper surface 11 a. In general, in thehexagonal single crystal ingot 11, the direction perpendicular to thedirection of extension of the shorter second orientation flat 15 is thedirection of inclination of the c-axis 19. The c-plane 21 is set in theingot 11 innumerably at the molecular level of the ingot 11. In thispreferred embodiment, the off angle α is set to 4°. However, the offangle α is not limited to 4° in the present invention. For example, theoff angle α may be freely set in the range of 1° to 6° in manufacturingthe ingot 11.

Referring again to FIG. 1, a column 52 is fixed to the left side of thestationary base 4. The column 52 is formed with a vertically elongatedopening 53, and a pressing mechanism 54 is vertically movably mounted tothe column 52 so as to project from the opening 53.

As shown in FIG. 4, the ingot 11 is fixed to the upper surface of thesupport table 26 by using a wax or adhesive in the condition where thesecond orientation flat 15 of the ingot 11 becomes parallel to the Xdirection. In other words, as shown in FIG. 5, the direction offormation of the off angle α is shown by an arrow Y1. That is, thedirection of the arrow Y1 is the direction where the intersection 19 abetween the c-axis 19 and the upper surface 11 a of the ingot 11 ispresent with respect to the normal 17 to the upper surface 11 a.Further, the direction perpendicular to the direction of the arrow Y1 isshown by an arrow A. Then, the ingot 11 is fixed to the support table 26in the condition where the direction of the arrow A becomes parallel tothe X direction.

Accordingly, the laser beam is scanned in the direction of the arrow Aperpendicular to the direction of the arrow Y1, or the direction offormation of the off angle α. In other words, the direction of the arrowA perpendicular to the direction of the arrow Y1 where the off angle αis formed is defined as the feeding direction of the support table 26.

In the wafer producing method of the present invention, it is importantthat the scanning direction of the laser beam to be applied from thefocusing means 36 is set to the direction of the arrow A perpendicularto the direction of the arrow Y1 where the off angle α of the ingot 11is formed. That is, it was found that by setting the scanning directionof the laser beam to the direction of the arrow A as mentioned above inthe wafer producing method of the present invention, cracks propagatingfrom a modified layer formed inside the ingot 11 by the laser beamextend very long along the c-plane 21.

In performing the wafer producing method according to this preferredembodiment, a separation start point forming step is performed in such amanner that the focal point of the laser beam having a transmissionwavelength (e.g., 1064 nm) to the hexagonal single crystal ingot 11fixed to the support table 26 is set inside the ingot 11 at apredetermined depth from the first surface (upper surface) 11 a, whichdepth corresponds to the thickness of a wafer to be produced, and thelaser beam is next applied to the upper surface 11 a as relativelymoving the focal point and the ingot 11 to thereby form a modified layer23 parallel to the upper surface 11 a and cracks 25 propagating from themodified layer 23 along the c-plane 21, thus forming a separation startpoint (separation plane) where the modified layer 23 and the cracks 25are formed.

This separation start point forming step includes a modified layerforming step of relatively moving the focal point of the laser beam inthe direction of the arrow A perpendicular to the direction of the arrowY1 where the c-axis 19 is inclined by the off angle α with respect tothe normal 17 to the upper surface 11 a and the off angle α is formedbetween the c-plane 21 and the upper surface 11 a, thereby forming themodified layer 23 inside the ingot 11 and the cracks 25 propagating fromthe modified layer 23 along the c-plane 21, and also includes anindexing step of relatively moving the focal point in the direction offormation of the off angle α, i.e., in the Y direction to thereby indexthe focal point by a predetermined amount as shown in FIG. 7 and FIGS.8A and 8B.

As shown in FIGS. 6 and 7, the modified layer 23 is linearly formed soas to extend in the X direction, so that the cracks 25 propagate fromthe modified layer 23 in opposite directions along the c-plane 21. Inthe wafer producing method according to this preferred embodiment, theseparation start point forming step further includes an index amountsetting step of measuring the width of the cracks 25 formed on one sideof the modified layer 23 along the c-plane 21 and then setting the indexamount of the focal point according to the width measured above. Morespecifically, letting W1 denote the width of the cracks 25 formed on oneside of the modified layer 23 so as to propagate from the modified layer23 along the c-plane 21, the index amount W2 of the focal point is setin the range of W1 to 2W1.

For example, the separation start point forming step is performed underthe following laser processing conditions.

Light source: Nd:YAG pulsed laser

Wavelength: 1064 nm

Repetition frequency: 80 kHz

Average power: 3.2 W

Pulse width: 4 ns

Spot diameter: 10 μm

Numerical aperture (NA) of the focusing lens: 0.45

Index amount: 400 μm

In the laser processing conditions mentioned above, the width W1 of thecracks 25 propagating from the modified layer 23 along the C-plane 21 inone direction as viewed in FIG. 6 is set to about 250 μm, and the indexamount W2 is set to 400 μm. However, the average power of the laser beamis not limited to 3.2 W. When the average power of the laser beam wasset to 2 to 4.5 W, good results were obtained in the preferredembodiment. In the case that the average power was set to 2 W, the widthW1 of the cracks 25 was about 100 μm. In the case that the average powerwas set to 4.5 W, the width W1 of the cracks 25 was about 350 μm.

In the case that the average power is less than 2 W or greater than 4.5W, the modified layer 23 cannot be well formed inside the ingot 11.Accordingly, the average power of the laser beam to be applied ispreferably set in the range of 2 to 4.5 W. For example, the averagepower of the laser beam to be applied to the ingot 11 was set to 3.2 Win this preferred embodiment. As shown in FIG. 6, the depth D1 of thefocal point from the upper surface 11 a in forming the modified layer 23was set to 500 μm.

Referring to FIG. 8A, there is shown a schematic plan view forillustrating the scanning direction of the laser beam. The separationstart point forming step is performed on a forward path X1 and abackward path X2 as shown in FIG. 8A. That is, the modified layer 23 isformed in the hexagonal single crystal ingot 11 on the forward path X1.Thereafter, the focal point of the laser beam is indexed by thepredetermined amount. Thereafter, the modified layer 23 is formed againin the ingot 11 on the backward path X2.

Further, in the case that the index amount of the focal point of thelaser beam is set in the range of W to 2 W where W is the width of thecracks 25 formed on one side of the modified layer 23 along the c-plane21, the index amount of the focal point is preferably set to W or lessuntil the modified layer 23 is first formed after setting the focalpoint of the laser beam inside the ingot 11.

For example, in the case that the index amount of the focal point of thelaser beam is 400 μm, the index amount is set to 200 μm until themodified layer 23 is first formed inside the ingot 11, and the laserbeam is scanned plural times with this index amount of 200 μm as shownin FIG. 8B. That is, a first part of the plural scanning paths of thelaser beam is idle, and when it is determined that the modified layer 23has been first formed inside the ingot 11, the index amount is set to400 μm and the modified layer 23 is then formed inside the ingot 11.

There will now be described a laser beam applying method in forming themodified layer inside the ingot 11, with reference to FIG. 9. First, thefocal point of the laser beam is set inside the ingot 11 at a radiallyinside position shown by a symbol C1, and the laser beam is next appliedto the ingot 11 as relatively moving the focal point of the laser beamin the direction shown by an arrow X1. Thereafter, the focal point ofthe laser beam is set again at the position C1, and the laser beam isnext applied to the ingot 11 as relatively moving the focal point of thelaser beam in the direction shown by an arrow X2.

Thereafter, the focal point of the laser beam is indexed by apredetermined amount in the Y direction where the off angle is formed.Thereafter, the focal point is set inside the ingot 11 at a radiallyinside position shown by a symbol C2, and the laser beam is applied tothe ingot 11 as relatively moving the focal point in the direction X1from the position C2 toward the outer circumference of the ingot 11.Thereafter, the focal point is set again at the position C2, and thelaser beam is next applied to the ingot 11 as relatively moving thefocal point in the direction X2 from the position C2 toward the outercircumference of the ingot 11. Thereafter, this step is similarlyperformed from other radially inside positions C3 and C4 toward theouter circumference of the ingot 11 in opposite directions aftersequentially indexing the focal point in the Y direction by thepredetermined amount.

In this manner, the laser beam is applied to the ingot 11 as relativelymoving the focal point of the laser beam from the radially insideposition inside the ingot 11 toward the outer circumference thereof,thereby forming a good modified layer 23 and cracks 25 inside the ingot11. Accordingly, when the laser beam is scanned to pass through theouter circumference of the ingot 11, a good modified layer 23 and cracks25 can be formed also at the outer circumference of the ingot 11 asbeing guided by the good modified layer 23 and cracks 25 previouslyformed inside the ingot 11. As a result, the outer circumferentialportion of the ingot 11 can be easily separated without the occurrenceof chipping in the next wafer separating step, thus obtaining a waferhaving good quality.

In contrast, when the focal point of the laser beam is moved from theouter circumference of the ingot 11 toward the radially inside positionas shown in FIG. 8A, the power of the laser beam concentrated at thefocal point changes from a low value to a high value during the movementfrom the outer circumference of the ingot 11 toward the radially insideposition. Thereafter, the power of the laser beam is kept stable at ahigh power. However, with this change in power of the laser beam from alow value to a high value, the position of the modified layer 23 takes aparabolic path to cause the formation of an undesired modified layer 23and cracks 25. As a result, there is a possibility that the separationof the outer circumferential portion of the ingot 11 in the waferseparating step may become difficult and chipping may also occur at theouter circumferential portion of the ingot 11, causing a reduction inquality.

As shown in FIG. 8B, the focal point of the laser beam is sequentiallyindexed to form a plurality of modified layers 23 at the depth D1 in thewhole area of the ingot 11 and the cracks 25 extending from eachmodified layer 23 along the c-plane 21. Thereafter, a wafer separatingstep is performed in such a manner that an external force is applied tothe ingot 11 to thereby separate a plate-shaped member having athickness corresponding to the thickness of the wafer to be producedfrom the ingot 11 at the separation start point composed of the modifiedlayers 23 and the cracks 25, thus producing a hexagonal single crystalwafer 27 shown in FIG. 11.

This wafer separating step is performed by using the pressing mechanism54 shown in FIG. 1. The configuration of the pressing mechanism 54 isshown in FIGS. 10A and 10B. The pressing mechanism 54 includes a head 56vertically movable by a moving mechanism (not shown) incorporated in thecolumn 52 shown in FIG. 1 and a pressing member 58 rotatable in thedirection shown by an arrow R in FIG. 10B with respect to the head 56.As shown in FIG. 10A, the pressing mechanism 54 is relatively positionedabove the ingot 11 fixed to the support table 26. Thereafter, as shownin FIG. 10B, the head 56 is lowered until the pressing member 58 comesinto pressure contact with the upper surface 11 a of the ingot 11.

In the condition where the pressing member 58 is in pressure contactwith the upper surface 11 a of the ingot 11, the pressing member 58 isrotated in the direction of the arrow R to thereby generate a torsionalstress in the ingot 11. As a result, the ingot 11 is broken at theseparation start point where the modified layers 23 and the cracks 25are formed. Accordingly, the hexagonal single crystal wafer 27 shown inFIG. 11 can be separated from the hexagonal single crystal ingot 11.After separating the wafer 27 from the ingot 11, the separation surfaceof the wafer 27 and the separation surface of the ingot 11 arepreferably polished to a mirror finish.

The present invention is not limited to the details of the abovedescribed preferred embodiment. The scope of the invention is defined bythe appended claims and all changes and modifications as fall within theequivalence of the scope of the claims are therefore to be embraced bythe invention.

What is claimed is:
 1. A wafer producing method for producing ahexagonal single crystal wafer from a hexagonal single crystal ingothaving a first surface, a second surface opposite to the first surface,a c-axis extending from the first surface to the second surface, and ac-plane perpendicular to the c-axis, where the c-plane is set in thehexagonal single crystal ingot at the molecular level, and where thec-axis is inclined by an off angle with respect to a normal to the firstsurface, wherein the c-axis and the normal to the first surfaceintersect each other, and thereby the c-plane is inclined by said offangle with respect to the first surface, the wafer producing methodcomprising: a separation start point forming step of setting a focalpoint of a laser beam having a transmission wavelength to the ingotinside the hexagonal single crystal ingot at a predetermined depth fromthe first surface, which predetermined depth corresponds to a thicknessof the wafer to be produced, and next applying the laser beam throughthe first surface as relatively moving the focal point and the hexagonalsingle crystal ingot to thereby form a modified layer parallel to thefirst surface and cracks extending from the modified layer along thec-plane, thus forming a separation start point; and a wafer separatingstep of separating the wafer from the hexagonal single crystal ingot atthe separation start point after performing the separation start pointforming step, thus producing the wafer from the hexagonal single crystalingot; the separation start point forming step including: a modifiedlayer forming sub-step of relatively moving the focal point of the laserbeam in a first direction, where the first direction is perpendicular toa second direction, and further wherein said second direction is adirection defined between said normal to the first surface and thec-axis, thereby linearly forming the modified layer extending in thefirst direction, and an indexing sub-step of relatively moving the focalpoint in the second direction to thereby index the focal point by apredetermined amount; wherein in the modified layer forming sub-step,the focal point of the laser beam is relatively moved along the firstdirection from a radially inside position inside the hexagonal singlecrystal ingot toward an outer circumference of the hexagonal singlecrystal ingot.
 2. The wafer producing method according to claim 1,wherein the hexagonal single crystal ingot is selected from a SiC singlecrystal ingot, GaN single crystal ingot, and AlN single crystal ingot.3. The wafer producing method according to claim 1, wherein when thefocal point of the laser beam is relatively moved in the first directionfrom the radially inside position toward the outer circumference duringthe modified layer forming sub-step, the focal point is relatively movedalong the first direction in opposite directions from the radiallyinside position.
 4. The wafer producing method according to claim 1,wherein during the modified layer forming sub-step, the focal point isset at the radially inside position a first time and is relatively movedalong the first direction one way and then the focal point is again setat the radially inside position a second time and is relatively movedalong the first direction in the opposite way.